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Journal description
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Details for article 34 of 36 found articles
| Title: |
Transient liquid phase diffusion bonding of 6061-13 vol.% SiCp composite using Cu powder interlayer: mechanism and interface characterization |
| Author: |
Maity, Joydeep Pal, Tapan Kumar Maiti, Rabindranath |
| Appeared in: |
Journal of materials science |
| Paging: | Volume 45 (2010) nr. 13 pages 3575-3587 |
| Year: |
2010 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 34 of 36 found articles
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