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Journal description
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Details for article 5 of 14 found articles
| Title: |
Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell |
| Author: |
Wafula, F. Liu, Y. Yin, L. Borgesen, P. Cotts, E. J. Dimitrov, N. |
| Appeared in: |
Journal of applied electrochemistry |
| Paging: | Volume 41 (2011) nr. 4 pages 469-480 |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Springer Netherlands, Dordrecht |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 5 of 14 found articles
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