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Details van artikel 2 van 12 gevonden artikelen
| Titel: |
Allocating solder-paste printing inspection in high-volume electronics manufacturing |
| Auteur: |
Valenzuela, Jorge F. Smith, Jeffrey S. Evans, John L. |
| Verschenen in: |
IIE transactions |
| Paginering: | Jaargang 36 (2004) nr. 12 pagina's 1171-1181 |
| Jaar: |
2004-12 |
| Inhoud: |
The paper describes an optimization model for allocating solder-paste printing inspection that explicitly considers the economic tradeoff between board yield and inspection accuracy. The paper also shows that the use of a heuristic solution method for solving the post-printing inspection allocation model is effective and efficient for high-volume electronics manufacturing. The model has been developed using real production and visual inspection data provided by a high-volume electronics manufacturer located in Huntsville, AL. In addition, randomly generated problems are used to evaluate the performance of the proposed heuristic. Results from a large case study show that when compared with a full post-printing inspection, the heuristic approach provides a solution that can increase the total expected gains by 15%. |
| Uitgever: |
Taylor & Francis |
| Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
Details van artikel 2 van 12 gevonden artikelen
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