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Journal description
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Details for article 2 of 65 found articles
| Title: |
A Model of Material Removal and Post Process Surface Topography for Copper CMP |
| Author: |
Choi, S. Doyle, F.M. Dornfeld, D. |
| Appeared in: |
Procedia engineering |
| Paging: | Volume 19 (2011) nr. C pages 8 p. |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 2 of 65 found articles
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