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Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer |
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Titel: |
Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer |
Auteur: |
Wang, Luhua Li, Jianwei Catalano, Massimo Bai, Guangzhu Li, Ning Dai, Jingjie Wang, Xitao Zhang, Hailong Wang, Jinguo Kim, Moon J. |
Verschenen in: |
Composites. Part A, Applied science and manufacturing |
Paginering: |
Jaargang 113 (2018) nr. C pagina's 76-82 |
Jaar: |
2018 |
Inhoud: |
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Uitgever: |
Elsevier Ltd |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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