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Journal description
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Details for article 12 of 30 found articles
| Title: |
Eliminate Kirkendall voids in solder reactions on nanotwinned copper |
| Author: |
Liu, Tao-Chi Liu, Chien-Min Huang, Yi-Sa Chen, Chih Tu, King-Ning |
| Appeared in: |
Scripta materialia |
| Paging: | Volume 68 (2013) nr. 5 pages 4 p. |
| Year: |
2013 |
| Contents: | |
| Publisher: |
Acta Materialia Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 12 of 30 found articles
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