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Details for article 22 of 34 found articles
| Title: |
Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints |
| Author: |
Zeng, Guang McDonald, Stuart D. Mu, Dekui Terada, Yasuko Yasuda, Hideyuki Gu, Qinfen Nogita, Kazuhiro |
| Appeared in: |
Intermetallics |
| Paging: | Volume 54 (2014) nr. C pages 8 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 22 of 34 found articles
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