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Journal description
All volumes of the corresponding journal
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Details for article 3 of 8 found articles
| Title: |
Microstructural characterization of Au/Sn solder for packaging in optoelectronic applications |
| Author: |
Ivey, D.G. |
| Appeared in: |
Micron |
| Paging: | Volume 29 (1998) nr. 4 pages 7 p. |
| Year: |
1998 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 8 found articles
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