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Journal description
All volumes of the corresponding journal
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Details for article 12 of 22 found articles
| Title: |
Numerical analysis of plastic encapsulated electronic package reliability: Viscoelastic properties of underfill resin |
| Author: |
Sham, Man-Lung Kim, Jang-Kyo Park, Joo-Hyuk |
| Appeared in: |
Computational materials science |
| Paging: | Volume 40 (2007) nr. 1 pages 9 p. |
| Year: |
2007 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 12 of 22 found articles
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