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Journal description
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Details for article 17 of 39 found articles
| Title: |
Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation |
| Author: |
Gong, Jicheng Liu, Changqing Conway, Paul P. Silberschmidt, Vadim V. |
| Appeared in: |
Computational materials science |
| Paging: | Volume 39 (2007) nr. 1 pages 11 p. |
| Year: |
2007 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 17 of 39 found articles
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