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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 23 of 25 found articles
| Title: |
Thermal performance of an aluminum honeycomb wallboard incorporating microencapsulated PCM |
| Author: |
Lai, Chi-ming Hokoi, Shuichi |
| Appeared in: |
Energy and buildings |
| Paging: | Volume 73 (2014) nr. C pages 11 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 23 of 25 found articles
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