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                                       Details for article 127 of 127 found articles
 
 
  XPS analysis of the groove wearing marks on flank face of diamond tool in nanometric cutting of silicon wafer
 
 
Title: XPS analysis of the groove wearing marks on flank face of diamond tool in nanometric cutting of silicon wafer
Author: Zong, W.J.
Sun, T.
Li, D.
Cheng, K.
Liang, Y.C.
Appeared in: International journal of machine tools & manufacture
Paging: Volume 48 (2008) nr. 15 pages 10 p.
Year: 2008
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 127 of 127 found articles
 
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