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Journal description
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Details for article 3 of 16 found articles
| Title: |
Analytical solution of heat conduction problem for a multilayer assembly arising in photothermal reliability testing |
| Author: |
Elperin, T. Rudin, G. |
| Appeared in: |
International communications in heat and mass transfer |
| Paging: | Volume 21 (1994) nr. 1 pages 10 p. |
| Year: |
1994 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 16 found articles
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