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Journal description
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Details for article 63 of 68 found articles
| Title: |
Thermo-mechanical analysis and interfacial energy release rate estimation for metal–insulator–metal capacitor device |
| Author: |
Hsieh, Ming-Che Wu, Sheng-Tsai Tain, Ra-Min Chen, Chao-Huang Lin, Cheng-Kuo |
| Appeared in: |
Microelectronic engineering |
| Paging: | Volume 88 (2011) nr. 5 pages 6 p. |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 63 of 68 found articles
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