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Journal description
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Details for article 40 of 68 found articles
| Title: |
Investigations regarding Through Silicon Via filling for 3D integration by Periodic Pulse Reverse plating with and without additives |
| Author: |
Hofmann, Lutz Ecke, Ramona Schulz, Stefan E. Gessner, Thomas |
| Appeared in: |
Microelectronic engineering |
| Paging: | Volume 88 (2011) nr. 5 pages 4 p. |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 40 of 68 found articles
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