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Journal description
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Details for article 38 of 68 found articles
| Title: |
Interconnect reliability – A study of the effect of dimensional and porosity scaling |
| Author: |
Croes, Kristof Wilson, Christopher J. Lofrano, Melina Beyer, Gerald P. Tőkei, Zsolt |
| Appeared in: |
Microelectronic engineering |
| Paging: | Volume 88 (2011) nr. 5 pages 6 p. |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 38 of 68 found articles
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