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Journal description
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Details for article 17 of 30 found articles
| Title: |
High-temperature wire sweep characteristics of semiconductor package for variable loop-height wirebonding technology |
| Author: |
Kung, Huang-Kuang Huang, Bo-Wun |
| Appeared in: |
Microelectronic engineering |
| Paging: | Volume 83 (2006) nr. 2 pages 9 p. |
| Year: |
2006 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 17 of 30 found articles
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