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Journal description
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Details for article 15 of 57 found articles
| Title: |
Copper chemical mechanical polishing using a slurry-free technique |
| Author: |
Nguyen, V.H. Hof, A.J. van Kranenburg, H. Woerlee, P.H. Weimar, F. |
| Appeared in: |
Microelectronic engineering |
| Paging: | Volume 55 (2001) nr. 1-4 pages 8 p. |
| Year: |
2001 |
| Contents: | |
| Publisher: |
Elsevier Science B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 15 of 57 found articles
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