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                                       Details for article 43 of 187 found articles
 
 
  Dense SiOC cap for damage-less ultra low k integration with direct CMP in C45 architecture and beyond
 
 
Title: Dense SiOC cap for damage-less ultra low k integration with direct CMP in C45 architecture and beyond
Author: Chapelon, L.L.
Chaabouni, H.
Imbert, G.
Brun, P.
Mellier, M.
Hamioud, K.
Vilmay, M.
Farcy, A.
Torres, J.
Appeared in: Microelectronic engineering
Paging: Volume 85 (2008) nr. 10 pages 4 p.
Year: 2008
Contents:
Publisher: Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 43 of 187 found articles
 
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