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                                       Details for article 122 of 187 found articles
 
 
  Nanomechanical analyses of porous SiO2 low-dielectric-constant films for evaluation of interconnect structure reliability
 
 
Title: Nanomechanical analyses of porous SiO2 low-dielectric-constant films for evaluation of interconnect structure reliability
Author: Chang, Shou-Yi
Huang, Yi-Chung
Appeared in: Microelectronic engineering
Paging: Volume 83 (2006) nr. 10 pages 10 p.
Year: 2006
Contents:
Publisher: Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 122 of 187 found articles
 
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