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Journal description
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Details for article 109 of 187 found articles
| Title: |
Interfacial reaction and shear strength of SnAgCu–xNi/Ni solder joints during aging at 150°C |
| Author: |
Yao, Pei Liu, Ping Liu, Jim |
| Appeared in: |
Microelectronic engineering |
| Paging: | Volume 86 (2009) nr. 10 pages 6 p. |
| Year: |
2009 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 109 of 187 found articles
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