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Details for article 9 of 50 found articles
| Title: |
Effect of Cu diffusion through Ni on the interfacial reactions of Sn3.5Ag0.75Cu and SnPb solders with Au/Ni/Cu substrate during aging |
| Author: |
Chen, H.T. Wang, C.Q. Li, M.Y. Tian, D.W. |
| Appeared in: |
Materials letters |
| Paging: | Volume 60 (2006) nr. 13-14 pages 4 p. |
| Year: |
2006 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 9 of 50 found articles
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