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Journal description
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Details for article 109 of 115 found articles
| Title: |
Thermal stability of intermetallic compounds at Sn-0.7Cu-10Bi-xNi/Co interface during reflows |
| Author: |
Gao, He Wei, Fuxiang Lin, Caixia Shu, Tie Sui, Yanwei Qi, Jiqiu Zhang, Xuping |
| Appeared in: |
Materials letters |
| Paging: | Volume 254 (2019) nr. C pages 69-72 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 109 of 115 found articles
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