|
| << previous |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 29 of 29 found articles
| Title: |
Trends in packaging and interconnection of integrated circuits |
| Author: | |
| Appeared in: |
Microelectronics journal |
| Paging: | Volume 17 (1986) nr. 5 pages 1 p. |
| Year: |
1986 |
| Contents: | |
| Publisher: |
Benn Electronics Publications Ltd. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 29 of 29 found articles
| << previous |