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                                       Details for article 27 of 29 found articles
 
 
  Techniques for dynamic analysis of bonding wire
 
 
Title: Techniques for dynamic analysis of bonding wire
Author: Saritas, R.
Khater, M.
Park, S.
Dagdelen, T.
Abdel-Rahman, E.
Yavuz, M.
Appeared in: Microelectronics reliability
Paging: Volume 58 (2016) nr. C pages 9 p.
Year: 2016
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 27 of 29 found articles
 
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