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Journal description
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Details for article 24 of 40 found articles
| Title: |
Induced thermo-mechanical reliability of copper-filled TSV interposer by transient selective annealing technology |
| Author: |
Lee, Chang-Chun Huang, Chien-Chao |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 55 (2015) nr. 11 pages 7 p. |
| Year: |
2015 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 24 of 40 found articles
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