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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 69 of 141 found articles
| Title: |
Joining and package technology for 175°C Tj increasing reliability in automotive applications |
| Author: |
Dietrich, Peter |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 54 (2014) nr. 9-10 pages 5 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 69 of 141 found articles
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