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                                       Details for article 6 of 21 found articles
 
 
  Electromigration challenges for advanced on-chip Cu interconnects
 
 
Title: Electromigration challenges for advanced on-chip Cu interconnects
Author: Li, Baozhen
Christiansen, Cathryn
Badami, Dinesh
Yang, Chih-Chao
Appeared in: Microelectronics reliability
Paging: Volume 54 (2014) nr. 4 pages 13 p.
Year: 2014
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 6 of 21 found articles
 
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