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Journal description
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Details for article 14 of 21 found articles
| Title: |
Numerical analysis of thermo-mechanical and mobility effects for 28nm node and beyond: Comparison and design consequences over bumping technologies |
| Author: |
Fiori, Vincent Ewuame, Komi-Atchou Gallois-Garreignot, Sébastien Jaouen, Hervé Tavernier, Clément |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 54 (2014) nr. 4 pages 9 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 14 of 21 found articles
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