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                                       Details for article 5 of 43 found articles
 
 
  An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler
 
 
Title: An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler
Author: Yim, Byung-Seung
Lee, Jeong Il
Lee, Byung Hun
Shin, Young-Eui
Kim, Jong-Min
Appeared in: Microelectronics reliability
Paging: Volume 54 (2014) nr. 12 pages 7 p.
Year: 2014
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 5 of 43 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands