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                                       Details for article 42 of 43 found articles
 
 
  The roles of dendritic spacings and Ag3Sn intermetallics on hardness of the SAC307 solder alloy
 
 
Title: The roles of dendritic spacings and Ag3Sn intermetallics on hardness of the SAC307 solder alloy
Author: Silva, Bismarck Luiz
Garcia, Amauri
Spinelli, José Eduardo
Appeared in: Microelectronics reliability
Paging: Volume 54 (2014) nr. 12 pages 6 p.
Year: 2014
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 42 of 43 found articles
 
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