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Journal description
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Details for article 27 of 43 found articles
| Title: |
Interval optimal design of 3-D TSV stacked chips package reliability by using the genetic algorithm method |
| Author: |
Cheng, Hsin-En Chen, Rong-Sheng |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 54 (2014) nr. 12 pages 17 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 27 of 43 found articles
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