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Journal description
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Details for article 19 of 49 found articles
| Title: |
Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics |
| Author: |
Ekpu, Mathias Bhatti, Raj Okereke, Michael I. Mallik, Sabuj Otiaba, Kenny |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 54 (2014) nr. 1 pages 6 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 19 of 49 found articles
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