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Fault isolation in semiconductor product, process, physical and package failure analysis: Importance and overview |
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Titel: |
Fault isolation in semiconductor product, process, physical and package failure analysis: Importance and overview |
Auteur: |
Chin, Jiann Min Narang, Vinod Zhao, Xiaole Tay, Meng Yeow Phoa, Angeline Ravikumar, Venkat Ei, Lwin Hnin Lim, Soon Huat Teo, Chea Wei Zulkifli, Syahirah Ong, Mei Chyn Tan, Ming Chuan |
Verschenen in: |
Microelectronics reliability |
Paginering: |
Jaargang 51 (2011) nr. 9-11 pagina's 9 p. |
Jaar: |
2011 |
Inhoud: |
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Uitgever: |
Published by Elsevier B.V. |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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