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Journal description
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Details for article 43 of 59 found articles
| Title: |
Reduction of defects in TSV filled with Cu by high-speed 3-step PPR for 3D Si chip stacking |
| Author: |
Hong, Sung Chul Lee, Wang Gu Kim, Won Joong Kim, Jong Hyeong Jung, Jae Pil |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 51 (2011) nr. 12 pages 8 p. |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 43 of 59 found articles
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