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Journal description
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Details for article 5 of 47 found articles
| Title: |
A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process |
| Author: |
Jang, Changsoo Han, Seongyoung Kim, Hangyu Kang, Sayoon |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 46 (2006) nr. 2-4 pages 9 p. |
| Year: |
2006 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 5 of 47 found articles
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