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                                       Details for article 12 of 37 found articles
 
 
  Impact of substituting SiO2 ILD by low k materials into AlCu RIE metallization
 
 
Title: Impact of substituting SiO2 ILD by low k materials into AlCu RIE metallization
Author: Weber, D
Höhnsdorf, F
Hausmann, A
Klipp, A
Stavreva, Z
Herrmann, J
Bauch, L
Neef, M.Junack, H
Nichterwitz, M
Finsterbusch, S
Liebmann, R
Kallis, N
Kieslich, A
Appeared in: Microelectronics reliability
Paging: Volume 41 (2001) nr. 7 pages 3 p.
Year: 2001
Contents:
Publisher: Elsevier Science Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 12 of 37 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands