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Journal description
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Details for article 1 of 18 found articles
| Title: |
A new approach to the dynamic thermal modelling of semiconductor packages |
| Author: |
Masana, F.N |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 41 (2001) nr. 6 pages 12 p. |
| Year: |
2001 |
| Contents: | |
| Publisher: |
Elsevier Science Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 1 of 18 found articles
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