|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 8 of 21 found articles
| Title: |
Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints |
| Author: |
Stam, F.A. Davitt, E. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 41 (2001) nr. 11 pages 8 p. |
| Year: |
2001 |
| Contents: | |
| Publisher: |
Elsevier Science Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 8 of 21 found articles
| << previous | next >> |