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Journal description
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Details for article 41 of 85 found articles
| Title: |
Failure analysis of integrated devices by scanning thermal microscopy (SThM) |
| Author: |
Fiege, G.B.M. Feige, V. Phang, J.C.H Maywald, M. Gorlich, S. Balk, L.J. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 38 (1998) nr. 6-8 pages 5 p. |
| Year: |
1998 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 41 of 85 found articles
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