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                                       Details for article 165 of 200 found articles
 
 
  Single wafer plasma etching. 2. SiO2: etching mechanisms and characteristics
 
 
Title: Single wafer plasma etching. 2. SiO2: etching mechanisms and characteristics
Author:
Appeared in: Microelectronics reliability
Paging: Volume 23 (1983) nr. 3 pages 2 p.
Year: 1983
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 165 of 200 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands