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Journal description
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Details for article 3 of 8 found articles
| Title: |
Effect of critical properties of epoxy molding compound on warpage prediction: A critical review |
| Author: |
Phansalkar, Sukrut Prashant Kim, Changsu Han, Bongtae |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 130 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 8 found articles
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